Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125795 | Integrated chip with inter-wire cavities | Chung-Ju Lee, Chih Wei Lu, Hsi-Wen Tien, Wei-Hao Liao, Yu-Teng Dai +2 more | 2024-10-22 |
| 12094823 | Interconnection structure and methods of forming the same | Wei-Hao Liao, Hsi-Wen Tien, Yu-Teng Dai, Chih Wei Lu, Chung-Ju Lee | 2024-09-17 |
| 11972975 | Semiconductor device structure having air gap and method for forming the same | Hsi-Wen Tien, Wei-Hao Liao, Yu-Teng Dai, Chih Wei Lu, Chung-Ju Lee +1 more | 2024-04-30 |
| 11942364 | Selective deposition of a protective layer to reduce interconnect structure critical dimensions | Hsi-Wen Tien, Chung-Ju Lee, Chih Wei Lu, Yu-Teng Dai, Wei-Hao Liao | 2024-03-26 |
| 11923293 | Barrier structure on interconnect wire to increase processing window for overlying via | Chung-Ju Lee, Chih Wei Lu, Hsi-Wen Tien, Wei-Hao Liao, Yu-Teng Dai | 2024-03-05 |