Issued Patents 2024
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12138011 | Image registration method and system thereof | Sung Wei Lu, Jia-Wei Lin, I-Ling Chen, Tuan-Shu Ho | 2024-11-12 |
| 12125795 | Integrated chip with inter-wire cavities | Hsin-Chieh Yao, Chung-Ju Lee, Hsi-Wen Tien, Wei-Hao Liao, Yu-Teng Dai +2 more | 2024-10-22 |
| 12094823 | Interconnection structure and methods of forming the same | Wei-Hao Liao, Hsi-Wen Tien, Yu-Teng Dai, Hsin-Chieh Yao, Chung-Ju Lee | 2024-09-17 |
| 12074059 | Semiconductor arrangement and method of making | Hsi-Wen Tien, Wei-Hao Liao, Pin-Ren Dai, Chung-Ju Lee | 2024-08-27 |
| 12059527 | Method for driving nebulizer and circuit system | HSIN-HUA TSENG, Chen-Hsiang Sang, Liang-Rern Kung, JO-LING WU, Shu-Pin Hsieh | 2024-08-13 |
| 12046551 | Interconnect structure having a barrier layer along the sidewall of self-aligned via structures | Chieh-Han Wu, Cheng-Hsiung Tsai, Chung-Ju Lee | 2024-07-23 |
| 11972975 | Semiconductor device structure having air gap and method for forming the same | Hsi-Wen Tien, Wei-Hao Liao, Yu-Teng Dai, Hsin-Chieh Yao, Chung-Ju Lee +1 more | 2024-04-30 |
| 11942364 | Selective deposition of a protective layer to reduce interconnect structure critical dimensions | Hsi-Wen Tien, Chung-Ju Lee, Hsin-Chieh Yao, Yu-Teng Dai, Wei-Hao Liao | 2024-03-26 |
| 11923293 | Barrier structure on interconnect wire to increase processing window for overlying via | Hsin-Chieh Yao, Chung-Ju Lee, Hsi-Wen Tien, Wei-Hao Liao, Yu-Teng Dai | 2024-03-05 |
| 11915943 | Methods of etching metals in semiconductor devices | Wei-Hao Liao, Hsi-Wen Tien, Pin-Ren Dai, Chung-Ju Lee | 2024-02-27 |
| 11882871 | Detachable atomizing device and container thereof | Chen-Hsiang Sang, Liang-Rern Kung, Wei CAI, JO-LING WU, Shu-Pin Hsieh | 2024-01-30 |