Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165920 | Semiconductor structure and method for forming the same | Hwei-Jay CHU, Cheng-Hsiung Tsai, Chung-Ju Lee | 2024-12-10 |
| 12046551 | Interconnect structure having a barrier layer along the sidewall of self-aligned via structures | Cheng-Hsiung Tsai, Chih Wei Lu, Chung-Ju Lee | 2024-07-23 |