Issued Patents 2024
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159840 | Scalable and interoperable PHYLESS die-to-die IO solution | Gerald Pasdast, Juan Zeng, Peipei Wang, Ahmad Siddiqui, Lakshmipriya Seshan | 2024-12-03 |
| 12125777 | Minimizing package impedance discontinuity through dielectric structure optimizations | Gang Duan, Kemal Aygun, Jieying Kong, Brandon C. Marin | 2024-10-22 |
| 12107060 | Microelectronic assemblies with inductors in direct bonding regions | Adel A. Elsherbini, Gerald Pasdast, Mohammad Enamul Kabir, Han Wui Then, Kimin Jun +5 more | 2024-10-01 |
| 12100662 | Power-forwarding bridge for inter-chip data signal transfer | Gerald Pasdast, Peipei Wang, Daniel Scott Krueger, Edward A. Burton | 2024-09-24 |
| 12062616 | Power delivery for embedded bridge die utilizing trench structures | Kemal Aygun, Jianyong Xie | 2024-08-13 |
| 12033930 | Selectively roughened copper architectures for low insertion loss conductive features | Jieying Kong, Yiyang Zhou, Suddhasattwa Nad, Jeremy Ecton, Hongxia Feng +9 more | 2024-07-09 |
| 12009320 | Interconnect loss of high density package with magnetic material | Cemil Geyik, Jiwei Sun, Gang Duan, Kemal Aygun | 2024-06-11 |
| 11984439 | Microelectronic assemblies | Adel A. Elsherbini, Georgios Dogiamis, Shawna M. Liff, Johanna M. Swan | 2024-05-14 |
| 11923308 | Die interconnect structures having bump field and ground plane | Kemal Aygun | 2024-03-05 |
| 11901280 | Ground via clustering for crosstalk mitigation | Kemal Aygun, Yu Zhang | 2024-02-13 |
| 11887932 | Dielectric-filled trench isolation of vias | Kemal Aygun, Jianyong Xie | 2024-01-30 |