Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854935 | Enhanced base die heat path using through-silicon vias | Weston BERTRAND, Kyle Arrington, Shankar Devasenathipathy, Aaron McCann, Zhimin Wan | 2023-12-26 |
| 11832419 | Full package vapor chamber with IHS | Nicholas S. Haehn, Je-Young Chang, Kyle Arrington, Aaron McCann, Edvin Cetegen +4 more | 2023-11-28 |
| 11804418 | Direct liquid micro jet (DLMJ) structures for addressing thermal performance at limited flow rate conditions | Je-Young Chang, Jae Whan Kim, Ravindranath V. Mahajan | 2023-10-31 |
| 11776864 | Corner guard for improved electroplated first level interconnect bump height range | Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho, Rahul Jain +4 more | 2023-10-03 |
| 11640929 | Thermal management solutions for cored substrates | Divya Mani, Nicholas S. Haehn | 2023-05-02 |
| 11594463 | Substrate thermal layer for heat spreader connection | Nicholas S. Haehn | 2023-02-28 |
| 11587843 | Thermal bump networks for integrated circuit device assemblies | Prasad Ramanathan, Chandra Mohan Jha | 2023-02-21 |