| 11850699 |
Switching control algorithms on detection of exposure of underlying layer during polishing |
Kun Xu, Harry Q. Lee, David Maxwell Gage |
2023-12-26 |
| 11791224 |
Technique for training neural network for use in in-situ monitoring during polishing and polishing system |
Kun Xu, Kiran Shrestha, Doyle E. Bennett, David Maxwell Gage, Jun Qian +1 more |
2023-10-17 |
| 11780047 |
Determination of substrate layer thickness with polishing pad wear compensation |
Kun Xu, Jun Qian, Kiran Shrestha |
2023-10-10 |
| 11731238 |
Monitoring of polishing pad texture in chemical mechanical polishing |
Thomas H. Osterheld |
2023-08-22 |
| 11733686 |
Machine learning systems for monitoring of semiconductor processing |
Graham Yennie |
2023-08-22 |
| 11710228 |
Detecting an excursion of a CMP component using time-based sequence of images and machine learning |
Sidney P. Huey, Thomas Li |
2023-07-25 |
| 11697187 |
Temperature-based assymetry correction during CMP and nozzle for media dispensing |
Haosheng Wu, Shou-Sung Chang, Jianshe Tang, Chih Chung, Hui Chen +1 more |
2023-07-11 |
| 11658078 |
Using a trained neural network for use in in-situ monitoring during polishing and polishing system |
Kun Xu, Kiran Shrestha, Doyle E. Bennett, David Maxwell Gage, Jun Qian +1 more |
2023-05-23 |
| 11651207 |
Training spectrum generation for machine learning system for spectrographic monitoring |
Nicholas A. Wiswell, Jun Qian, Thomas H. Osterheld |
2023-05-16 |
| 11577356 |
Machine vision as input to a CMP process control algorithm |
Jun Qian, Nicholas A. Wiswell, Dominic J. Benvegnu, Boguslaw A. Swedek, Thomas H. Osterheld |
2023-02-14 |
