Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776109 | Thickness measurement of substrate using color metrology | Nojan Motamedi, Dominic J. Benvegnu, Martin A. Josefowicz | 2023-10-03 |
| 11774235 | Grouping spectral data from polishing substrates | Jeffrey Drue David | 2023-10-03 |
| 11715193 | Color imaging for CMP monitoring | Dominic J. Benvegnu, Robert D. Tolles, Abraham Ravid | 2023-08-01 |
| 11715672 | Endpoint detection for chemical mechanical polishing based on spectrometry | Dominic J. Benvegnu, Jeffrey Drue David | 2023-08-01 |
| 11701749 | Monitoring of vibrations during chemical mechanical polishing | Dominic J. Benvegnu, Chih Chung Chou, Nicholas A. Wiswell, Thomas H. Osterheld, Jeonghoon Oh | 2023-07-18 |
| 11699595 | Imaging for monitoring thickness in a substrate cleaning system | Dominic J. Benvegnu, Jun Qian, Thomas H. Osterheld | 2023-07-11 |
| 11691244 | Multi-toothed, magnetically controlled retaining ring | — | 2023-07-04 |
| 11638982 | Core configuration for in-situ electromagnetic induction monitoring system | Hassan G. Iravani, Kun Xu, Denis Ivanov, Shih-Haur Shen | 2023-05-02 |
| 11577356 | Machine vision as input to a CMP process control algorithm | Benjamin Cherian, Jun Qian, Nicholas A. Wiswell, Dominic J. Benvegnu, Thomas H. Osterheld | 2023-02-14 |
| 11557048 | Thickness measurement of substrate using color metrology | Dominic J. Benvegnu | 2023-01-17 |