Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11774235 | Grouping spectral data from polishing substrates | Boguslaw A. Swedek | 2023-10-03 |
| 11763446 | Wafer bin map based root cause analysis | Tomonori Honda, Lin Lee Cheong, Richard Burch, Qing Zhu, Michael Keleher | 2023-09-19 |
| 11715672 | Endpoint detection for chemical mechanical polishing based on spectrometry | Dominic J. Benvegnu, Boguslaw A. Swedek | 2023-08-01 |
| 11609812 | Anomalous equipment trace detection and classification | Richard Burch, Qing Zhu, Tomonori Honda, Lin Lee Cheong | 2023-03-21 |