JQ

Jun Qian

Applied Materials: 8 patents #67 of 1,729Top 4%
Lam Research: 2 patents #36 of 269Top 15%
NE Nec: 1 patents #382 of 887Top 45%
IBM: 1 patents #2,552 of 6,852Top 40%
Overall (2023): #5,675 of 537,848Top 2%
12
Patents 2023

Issued Patents 2023

Patent #TitleCo-InventorsDate
11847776 System using film thickness estimation from machine learning based processing of substrate images Sivakumar Dhandapani, Arash Alahgholipouromrani, Dominic J. Benvegnu, Kiran Shrestha 2023-12-19
11838092 Wireless communication apparatus and method Kosuke Tanabe, Nader Zein, Christos Masouros 2023-12-05
11836913 Film thickness estimation from machine learning based processing of substrate images Sivakumar Dhandapani, Arash Alahgholipouromrani, Dominic J. Benvegnu, Kiran Shrestha 2023-12-05
11791224 Technique for training neural network for use in in-situ monitoring during polishing and polishing system Kun Xu, Kiran Shrestha, Doyle E. Bennett, David Maxwell Gage, Benjamin Cherian +1 more 2023-10-17
11780047 Determination of substrate layer thickness with polishing pad wear compensation Kun Xu, Benjamin Cherian, Kiran Shrestha 2023-10-10
11699595 Imaging for monitoring thickness in a substrate cleaning system Dominic J. Benvegnu, Boguslaw A. Swedek, Thomas H. Osterheld 2023-07-11
11670503 Method of atomic layer deposition Hu Kang, Adrien LaVoie, Seiji Matsuyama, Purushottam Kumar 2023-06-06
11663914 Geohash-based traffic management Cheng Luo, Lan Cao, Shiwen He, Ke Zhang, Yuan Yuan Jia 2023-05-30
11658078 Using a trained neural network for use in in-situ monitoring during polishing and polishing system Kun Xu, Kiran Shrestha, Doyle E. Bennett, David Maxwell Gage, Benjamin Cherian +1 more 2023-05-23
11651207 Training spectrum generation for machine learning system for spectrographic monitoring Benjamin Cherian, Nicholas A. Wiswell, Thomas H. Osterheld 2023-05-16
11646198 Ultrathin atomic layer deposition film accuracy thickness control Hu Kang, Adrien LaVoie, Seiji Matsuyama, Purushottam Kumar 2023-05-09
11577356 Machine vision as input to a CMP process control algorithm Benjamin Cherian, Nicholas A. Wiswell, Dominic J. Benvegnu, Boguslaw A. Swedek, Thomas H. Osterheld 2023-02-14