Issued Patents 2022
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538691 | Gas phase etch with controllable etch selectivity of Si-containing arc or silicon oxynitride to different films or masks | Subhadeep Kal, Nihar Mohanty, Aelan Mosden, Scott Lefevre | 2022-12-27 |
| 11515203 | Selective deposition of conductive cap for fully-aligned-via (FAV) | Yen-Tien Lu, Kai-Hung Yu, Xinghua Sun | 2022-11-29 |
| 11495436 | Systems and methods to control critical dimension (CD) shrink ratio through radio frequency (RF) pulsing | Junling Sun, Andrew Metz | 2022-11-08 |
| 11482454 | Methods for forming self-aligned contacts using spin-on silicon carbide | Junling Sun, Lior Huli, Andrew Metz | 2022-10-25 |
| 11424123 | Forming a semiconductor feature using atomic layer etch | Eric Chih-Fang Liu, Akiteru Ko, Henan Zhang, Shan Hu, Subhadeep Kal | 2022-08-23 |
| 11410852 | Protective layers and methods of formation during plasma etching processes | Katie Lutker-Lee | 2022-08-09 |
| 11398379 | Platform and method of operating for integrated end-to-end self-aligned multi-patterning process | Robert D. Clark, Richard A. Farrell, Kandabara Tapily, Sophie Thibaut | 2022-07-26 |
| 11380554 | Gas phase etching system and method | Subhadeep Kal, Nihar Mohanty, Aelan Mosden, Scott Lefevre | 2022-07-05 |
| 11361993 | Method for inverse via patterning for back end of line dual damascene structures | Katie Lutker-Lee | 2022-06-14 |
| 11333968 | Method for reducing lithography defects and pattern transfer | Eric Chih-Fang Liu, Nihar Mohanty | 2022-05-17 |
| 11322364 | Method of patterning a metal film with improved sidewall roughness | Nicholas Joy | 2022-05-03 |
| 11289325 | Radiation of substrates during processing and systems thereof | Michael Edley, Xinghua Sun, Yen-Tien Lu, Henan Zhang, Hiroyuki Suzuki +1 more | 2022-03-29 |
| 11227767 | Critical dimension trimming method designed to minimize line width roughness and line edge roughness | Kal Subhadeep | 2022-01-18 |