Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462414 | Atomic layer etching of metal oxides | — | 2022-10-04 |
| 11456212 | Platform and method of operating for integrated end-to-end fully self-aligned interconnect process | Kandabara Tapily, Kai-Hung Yu | 2022-09-27 |
| 11424236 | Facilitating alignment of stacked chiplets | — | 2022-08-23 |
| 11398379 | Platform and method of operating for integrated end-to-end self-aligned multi-patterning process | Richard A. Farrell, Kandabara Tapily, Angelique Raley, Sophie Thibaut | 2022-07-26 |
| 11302588 | Platform and method of operating for integrated end-to-end area-selective deposition process | Kandabara Tapily, Jason Mehigan | 2022-04-12 |
| 11264254 | Substrate processing tool with integrated metrology and method of using | Kandabara Tapily | 2022-03-01 |