Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515203 | Selective deposition of conductive cap for fully-aligned-via (FAV) | Yen-Tien Lu, Xinghua Sun, Angelique Raley | 2022-11-29 |
| D968749 | Food product | Huaizhang Wang, Kuangzheng Ding | 2022-11-08 |
| 11456212 | Platform and method of operating for integrated end-to-end fully self-aligned interconnect process | Robert D. Clark, Kandabara Tapily | 2022-09-27 |
| 11450562 | Method of bottom-up metallization in a recessed feature | Jodi Grzeskowiak, Nicholas Joy, Jeffrey Smith | 2022-09-20 |