Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450562 | Method of bottom-up metallization in a recessed feature | Kai-Hung Yu, Nicholas Joy, Jeffrey Smith | 2022-09-20 |
| 11417526 | Multiple patterning processes | David L. O'Meara, Eric Chih-Fang Liu, Anton J. deVilliers, Akiteru Ko, Anthony Dip | 2022-08-16 |
| 11393694 | Method for planarization of organic films | Anton J. deVilliers, Robert Brandt, Jeffrey Smith, Daniel Fulford | 2022-07-19 |
| 11342427 | 3D directed self-assembly for nanostructures | Anton J. deVilliers, Lars Liebmann, Daniel Chanemougame | 2022-05-24 |
| 11335566 | Method for planarization of spin-on and CVD-deposited organic films | Daniel Fulford, Anton J. deVilliers | 2022-05-17 |
| 11322401 | Reverse contact and silicide process for three-dimensional semiconductor devices | Jeffrey Smith, Lars Liebmann, Daniel Chanemougame, Hiroki Niimi, Kandabara Tapily +2 more | 2022-05-03 |
| 11264274 | Reverse contact and silicide process for three-dimensional logic devices | Jeffrey Smith, Hiroaki Niimi, Daniel Chanemougame, Lars Liebmann, Kandabara Tapily +2 more | 2022-03-01 |