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Anton J. deVilliers

TL Tokyo Electron Limited: 24 patents #1 of 896Top 1%
Overall (2022): #1,367 of 548,613Top 1%
24
Patents 2022

Issued Patents 2022

Patent #TitleCo-InventorsDate
11526088 Coaxial see-through alignment imaging system Anthony R. Schepis, David Conklin 2022-12-13
11513445 Tunable wavelength see-through layer stack 2022-11-29
11495540 Semiconductor apparatus having stacked devices and method of manufacture thereof Lars Liebmann, Jeffrey Smith 2022-11-08
11488947 Highly regular logic design for efficient 3D integration Lars Liebmann, Jeffrey Smith, Daniel Chanemougame 2022-11-01
11484993 Substrate holding apparatus and method for shape metrology Hoyoung Kang 2022-11-01
11460775 Method and system for prevention of metal contamination by using a self-assembled monolayer coating Hoyoung Kang, Corey Lemley 2022-10-04
11450671 Semiconductor apparatus having stacked devices and method of manufacture thereof Lars Liebmann, Jeffrey Smith, Daniel Chanemougame 2022-09-20
11444082 Semiconductor apparatus having stacked gates and method of manufacture thereof Jeffrey Smith, Kandabara Tapily, Subhadeep Kal, Gerrit J. Leusink 2022-09-13
11443953 Method for forming and using stress-tuned silicon oxide films in semiconductor device patterning Kandabara Tapily, Gerrit J. Leusink 2022-09-13
11437376 Compact 3D stacked-CFET architecture for complex logic cells Lars Liebmann, Jeffrey Smith, Daniel Chanemougame 2022-09-06
11417526 Multiple patterning processes David L. O'Meara, Eric Chih-Fang Liu, Jodi Grzeskowiak, Akiteru Ko, Anthony Dip 2022-08-16
11393694 Method for planarization of organic films Robert Brandt, Jeffrey Smith, Jodi Grzeskowiak, Daniel Fulford 2022-07-19
11383211 Point-of-use dynamic concentration delivery system with high flow and high uniformity Ronald Nasman, Lior Huli, Rodney L. Robison, Norman A. Jacobson, Jr., James Grootegoed 2022-07-12
11360388 Critical dimension correction via calibrated trim dosing Ronald Nasman, Jeffrey Smith 2022-06-14
11342427 3D directed self-assembly for nanostructures Jodi Grzeskowiak, Lars Liebmann, Daniel Chanemougame 2022-05-24
11335599 Self-aligned contacts for 3D logic and memory Lars Liebmann, Jeffrey Smith, Kandabara Tapily 2022-05-17
11335566 Method for planarization of spin-on and CVD-deposited organic films Daniel Fulford, Jodi Grzeskowiak 2022-05-17
11322401 Reverse contact and silicide process for three-dimensional semiconductor devices Jeffrey Smith, Lars Liebmann, Daniel Chanemougame, Hiroki Niimi, Kandabara Tapily +2 more 2022-05-03
11264289 Method for threshold voltage tuning through selective deposition of high-K metal gate (HKMG) film stacks Jeffrey Smith, Kandabara Tapily, Lars Liebmann, Daniel Chanemougame, Mark I. Gardner +1 more 2022-03-01
11264274 Reverse contact and silicide process for three-dimensional logic devices Jeffrey Smith, Hiroaki Niimi, Jodi Grzeskowiak, Daniel Chanemougame, Lars Liebmann +2 more 2022-03-01
11247309 Substrate holding apparatus and method for shape metrology Hoyoung Kang 2022-02-15
11251200 Coaxial contacts for 3D logic and memory Lars Liebmann, Jeffrey Smith, Kandabara Tapily 2022-02-15
11251080 Method of making 3D circuits with integrated stacked 3D metal lines for high density circuits Mark I. Gardner, H. Jim Fulford 2022-02-15
11217583 Architecture design of monolithically integrated 3D CMOS logic and memory Lars Liebmann, Jeffrey Smith, Kandabara Tapily 2022-01-04