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Home › 2022 › AMD › Mark I. Gardner

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Mark I. Gardner — 17 Patents in 2022

TLTokyo Electron Limited: 17 patents #2 of 896Top 1%

Prairieville, TX: #1 of 1 inventorsTop 100%

Texas: #82 of 16,454 inventorsTop 1%

Overall (2022): #2,768 of 548,613Top 1%

17 Patents 2022

Issued Patents 2022

Showing 1–17 of 17 patents

Patent #	Title	Co-Inventors	Date
11527545	Architecture design and process for 3D logic and 3D memory	H. Jim Fulford	2022-12-13
11521972	High performance multi-dimensional device and logic integration	H. Jim Fulford	2022-12-06
11515306	Unified architectural design for enhanced 3D circuit options	H. Jim Fulford	2022-11-29
11508625	Method of making a continuous channel between 3D CMOS	H. Jim Fulford	2022-11-22
11410888	Method of making 3D CMOS with integrated channel and S/D regions	H. Jim Fulford	2022-08-09
11410992	3D semiconductor apparatus manufactured with a cantilever structure and method of manufacture thereof	H. Jim Fulford	2022-08-09
11393813	Method of architecture design for enhanced 3D device performance	H. Jim Fulford	2022-07-19
11362091	Multiple nano layer transistor layers with different transistor architectures for improved circuit layout and performance	H. Jim Fulford	2022-06-14
11342339	Method of making six transistor SRAM cell using connections between 3D transistor stacks	H. Jim Fulford	2022-05-24
11302587	Method for fabricating a 3D semiconductor apparatus having two vertically disposed seminconductor devices	H. Jim Fulford	2022-04-12
11282828	High density architecture design for 3D logic and 3D memory circuits	H. Jim Fulford	2022-03-22
11276704	Device and method of forming with three-dimensional memory and three-dimensional logic	H. Jim Fulford	2022-03-15
11264285	Method for forming film stacks with multiple planes of transistors having different transistor architectures	Jim Fulford	2022-03-01
11264289	Method for threshold voltage tuning through selective deposition of high-K metal gate (HKMG) film stacks	Jeffrey Smith, Kandabara Tapily, Lars Liebmann, Daniel Chanemougame, H. Jim Fulford +1 more	2022-03-01
11251080	Method of making 3D circuits with integrated stacked 3D metal lines for high density circuits	H. Jim Fulford, Anton J. deVilliers	2022-02-15
11251159	High performance CMOS using 3D device layout	H. Jim Fulford	2022-02-15
11222964	Multiple planes of transistors with different transistor architectures to enhance 3D logic and memory circuits	H. Jim Fulford	2022-01-11