| 11532708 |
Stacked three-dimensional field-effect transistors |
Jeffrey Smith, Daniel Chanemougame, Paul Gutwin |
2022-12-20 |
| 11495540 |
Semiconductor apparatus having stacked devices and method of manufacture thereof |
Jeffrey Smith, Anton J. deVilliers |
2022-11-08 |
| 11488947 |
Highly regular logic design for efficient 3D integration |
Jeffrey Smith, Daniel Chanemougame, Anton J. deVilliers |
2022-11-01 |
| 11469309 |
Gate contact structures and cross-coupled contact structures for transistor devices |
Ruilong Xie, Youngtag Woo, Daniel Chanemougame, Bipul C. Paul, Heimanu Niebojewski +3 more |
2022-10-11 |
| 11469146 |
Methods of performing fin cut etch processes for FinFET semiconductor devices |
Lei Zhuang, Balasubramanian Pranatharthiharan, Ruilong Xie, Terence B. Hook |
2022-10-11 |
| 11450671 |
Semiconductor apparatus having stacked devices and method of manufacture thereof |
Jeffrey Smith, Anton J. deVilliers, Daniel Chanemougame |
2022-09-20 |
| 11437376 |
Compact 3D stacked-CFET architecture for complex logic cells |
Jeffrey Smith, Anton J. deVilliers, Daniel Chanemougame |
2022-09-06 |
| 11342427 |
3D directed self-assembly for nanostructures |
Anton J. deVilliers, Jodi Grzeskowiak, Daniel Chanemougame |
2022-05-24 |
| 11335599 |
Self-aligned contacts for 3D logic and memory |
Jeffrey Smith, Anton J. deVilliers, Kandabara Tapily |
2022-05-17 |
| 11322401 |
Reverse contact and silicide process for three-dimensional semiconductor devices |
Jeffrey Smith, Daniel Chanemougame, Hiroki Niimi, Kandabara Tapily, Subhadeep Kal +2 more |
2022-05-03 |
| 11309210 |
Self aligned buried power rail |
Nicholas V. LiCausi, Guillaume Bouche |
2022-04-19 |
| 11264289 |
Method for threshold voltage tuning through selective deposition of high-K metal gate (HKMG) film stacks |
Jeffrey Smith, Kandabara Tapily, Daniel Chanemougame, Mark I. Gardner, H. Jim Fulford +1 more |
2022-03-01 |
| 11264274 |
Reverse contact and silicide process for three-dimensional logic devices |
Jeffrey Smith, Hiroaki Niimi, Jodi Grzeskowiak, Daniel Chanemougame, Kandabara Tapily +2 more |
2022-03-01 |
| 11251200 |
Coaxial contacts for 3D logic and memory |
Jeffrey Smith, Anton J. deVilliers, Kandabara Tapily |
2022-02-15 |
| 11233006 |
Metallization lines on integrated circuit products |
Ruilong Xie, Daniel Chanemougame, Geng Han |
2022-01-25 |
| 11217583 |
Architecture design of monolithically integrated 3D CMOS logic and memory |
Jeffrey Smith, Anton J. deVilliers, Kandabara Tapily |
2022-01-04 |