Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Reverse contact and silicide process for three-dimensional logic devices

Reverse contact and silicide process for three-dimensional logic devices

US Patent 11264274 · Granted Mar 1, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Surface modification to achieve selective isotropic etch2025
Apparatus and method for wafer alignment2025
Method for chuck compensation via wafer shape control2025
Wafer chuck designs and methods for retaining a processing liquid on a surface o2025
Wet-dry bilayer resist2025
Atomic layer deposition of aluminum oxide films for semiconductor devices using 2025
Method to form narrow slot contacts2025
Thermal etching of ruthenium2025
In-situ lithography pattern enhancement with localized stress treatment tuning u2025
Etch selectivity modulation by fluorocarbon treatment2025
Inverted top-tier FET for multi-tier gate-on-gate 3-dimension integration (3Di)2025
Inverted top-tier FET for multi-tier gate-on-gate 3-dimension integration (3Di)2025