Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › In-situ lithography pattern enhancement with localized stress treatment tuning using heat zones

In-situ lithography pattern enhancement with localized stress treatment tuning using heat zones

US Patent 12455511 · Granted Oct 28, 2025

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatus and method for wafer alignment2025
Apparatus and method for wafer alignment2025
3D isolation of a segmentated 3D nanosheet channel region2025
3D isolation of a segmentated 3D nanosheet channel region2025
Method for chuck compensation via wafer shape control2025
Method for chuck compensation via wafer shape control2025
Method for chuck compensation via wafer shape control2025
Wafer chuck designs and methods for retaining a processing liquid on a surface o2025
3D isolation of a segmentated 3D nanosheet channel region2025
3D isolation of a segmentated 3D nanosheet channel region2025
3D advanced transistor architecture integrated with source/drain spider design2025
3D advanced transistor architecture integrated with source/drain spider design2025