Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11374101 | Dual metal wrap-around contacts for semiconductor devices | Kandabara Tapily, Takahiro Hakamata | 2022-06-28 |
| 11264274 | Reverse contact and silicide process for three-dimensional logic devices | Jeffrey Smith, Jodi Grzeskowiak, Daniel Chanemougame, Lars Liebmann, Kandabara Tapily +2 more | 2022-03-01 |