Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424123 | Forming a semiconductor feature using atomic layer etch | Akiteru Ko, Angelique Raley, Henan Zhang, Shan Hu, Subhadeep Kal | 2022-08-23 |
| 11417526 | Multiple patterning processes | David L. O'Meara, Jodi Grzeskowiak, Anton J. deVilliers, Akiteru Ko, Anthony Dip | 2022-08-16 |
| 11395687 | Insertion tool for flip anchor cable system insertion | This Aebi, Daniel Andermatt, Mirko Rocci | 2022-07-26 |
| 11333968 | Method for reducing lithography defects and pattern transfer | Angelique Raley, Nihar Mohanty | 2022-05-17 |