Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11537049 | Method of line roughness improvement by plasma selective deposition | Toshiharu Wada, Chia-Yun Hsieh | 2022-12-27 |
| 11515160 | Substrate processing method using multiline patterning | — | 2022-11-29 |
| 11424123 | Forming a semiconductor feature using atomic layer etch | Eric Chih-Fang Liu, Angelique Raley, Henan Zhang, Shan Hu, Subhadeep Kal | 2022-08-23 |
| 11417526 | Multiple patterning processes | David L. O'Meara, Eric Chih-Fang Liu, Jodi Grzeskowiak, Anton J. deVilliers, Anthony Dip | 2022-08-16 |
| 11380579 | Method and process using dual memorization layer for multi-color spacer patterning | Hirokazu Aizawa, Kaoru Maekawa | 2022-07-05 |
| 11372332 | Plasma treatment method to improve photo resist roughness and remove photo resist scum | Wan Jae Park | 2022-06-28 |