Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11537049 | Method of line roughness improvement by plasma selective deposition | Chia-Yun Hsieh, Akiteru Ko | 2022-12-27 |
| 11276572 | Technique for multi-patterning substrates | — | 2022-03-15 |