Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450562 | Method of bottom-up metallization in a recessed feature | Kai-Hung Yu, Jodi Grzeskowiak, Jeffrey Smith | 2022-09-20 |
| 11322364 | Method of patterning a metal film with improved sidewall roughness | Angelique Raley | 2022-05-03 |