Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462469 | Single mask lithography line end enhancement | Kevin Lin, Richard E. Schenker | 2022-10-04 |
| 11444024 | Subtractively patterned interconnect structures for integrated circuits | Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more | 2022-09-13 |
| 11424160 | Self-aligned local interconnects | Aaron D. Lilak, Ehren Mannebach, Anh Phan, Richard E. Schenker, Stephanie A. Bojarski +5 more | 2022-08-23 |
| 11404482 | Self-aligned repeatedly stackable 3D vertical RRAM | Noriyuki Sato, Kevin P. O'Brien, Eungnak Han, Manish Chandhok, Gurpreet Singh +4 more | 2022-08-02 |
| 11404307 | Interconnect structures and methods of fabrication | Manish Chandhok, Ramanan V. Chebiam, Brennen Mueller, Colin T. Carver, Jeffery D. Bielefeld +2 more | 2022-08-02 |
| 11342227 | Stacked transistor structures with asymmetrical terminal interconnects | Aaron D. Lilak, Ehren Mannebach, Patrick Morrow, Gilbert Dewey, Willy Rachmady +1 more | 2022-05-24 |
| 11289421 | Methods and structures for improved electrical contact between bonded integrated circuit interfaces | Richard Vreeland, Colin T. Carver, William Brezinski, Michael Christenson | 2022-03-29 |
| 11239156 | Planar slab vias for integrated circuit interconnects | Elijah V. Karpov, Manish Chandhok | 2022-02-01 |