Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211345 | In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the same | Aleksandar Aleksov, Telesphor Kamgaing, Kristof Darmawikarta, Eyal Fayneh, Ofir Degani +2 more | 2021-12-28 |
| 11101222 | Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers | Srinivas V. Pietambaram, Robert Alan May, Kristof Darmawikarta, Javier Soto Gonzalez, Kwangmo Chris Lim | 2021-08-24 |
| 11075130 | Package substrate having polymer-derived ceramic core | Lisa Ying Ying Chen, Lauren A. Link, Robert Alan May, Amruthavalli Pallavi Alur, Kristof Darmawikarta +3 more | 2021-07-27 |
| 11069620 | Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate | Robert Alan May, Kristof Darmawikarta | 2021-07-20 |
| 11043457 | Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same | Amruthavalli Pallavi Alur, Robert Alan May, Islam A. Salama, Robert L. Sankman | 2021-06-22 |
| 11037802 | Package substrate having copper alloy sputter seed layer and high density interconnects | Robert Alan May, Kristof Darmawikarta, Sandeep Gaan, Srinivas V. Pietambaram | 2021-06-15 |
| 10978399 | Die interconnect substrate, an electrical device, and a method for forming a die interconnect substrate | Kristof Darmawikarta, Robert Alan May, Wei-Lun Kane Jen, Javier Soto Gonzalez | 2021-04-13 |