Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164818 | Inorganic-based embedded-die layers for modular semiconductive devices | Srinivas V. Pietambaram, Tarek A. Ibrahim, Kristof Darmawikarta, Rahul N. Manepalli, Robert L. Sankman | 2021-11-02 |
| 11127706 | Electronic package with stud bump electrical connections | Zhaozhi Li, Sanka Ganesan, Gregory Perry, Kuan-Hsun Lu, Omkar G. Karhade +1 more | 2021-09-21 |
| 11011448 | IC package including multi-chip unit with bonded integrated heat spreader | Ravindranath V. Mahajan, Digvijay A. Raorane | 2021-05-18 |
| 10998262 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Jiun Hann Sir, Poh Boon Khoo, Eng Huat Goh, Amruthavalli Pallavi Alur | 2021-05-04 |
| 10910317 | Semiconductor package having wafer-level active die and external die mount | Vipul V. Mehta, Eric J. Li, Sanka Ganesan, Robert L. Sankman | 2021-02-02 |