Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195723 | Non-atomic layer deposition (ALD) method of forming sidewall passivation layer during high aspect ratio carbon layer etch | Shihsheng Chang, Andrew Metz, Yun Han | 2021-12-07 |
| 11164781 | ALD (atomic layer deposition) liner for via profile control and related applications | Xinghua Sun, Yen-Tien Lu, Angelique Raley, Jeffrey Smith | 2021-11-02 |
| 11024535 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | Kai-Hung Yu, Nicholas Joy, Gyanaranjan Pattanaik, Robert D. Clark, Kandabara Tapily +3 more | 2021-06-01 |
| 10978307 | Deposition process | Eric Chih-Fang Liu, Richard A. Farrell, Soo Doo Chae | 2021-04-13 |
| 10964587 | Atomic layer deposition for low-K trench protection during etch | Yen-Tien Lu, Angelique Raley, Xinghua Sun | 2021-03-30 |