Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195723 | Non-atomic layer deposition (ALD) method of forming sidewall passivation layer during high aspect ratio carbon layer etch | David L. O'Meara, Andrew Metz, Yun Han | 2021-12-07 |
| 10937659 | Method of anisotropically etching adjacent lines with multi-color selectivity | Andrew Metz | 2021-03-02 |