Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195723 | Non-atomic layer deposition (ALD) method of forming sidewall passivation layer during high aspect ratio carbon layer etch | Shihsheng Chang, David L. O'Meara, Andrew Metz | 2021-12-07 |
| 11094543 | Defect correction on metal resists | Peter Ventzek, Alok Ranjan | 2021-08-17 |
| 11079682 | Methods for extreme ultraviolet (EUV) resist patterning development | Peter L. G. Ventzek, Alok Ranjan | 2021-08-03 |