Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195723 | Non-atomic layer deposition (ALD) method of forming sidewall passivation layer during high aspect ratio carbon layer etch | Shihsheng Chang, David L. O'Meara, Yun Han | 2021-12-07 |
| 11127594 | Manufacturing methods for mandrel pull from spacers for multi-color patterning | Xinghua Sun, Angelique Raley | 2021-09-21 |
| 11121027 | High aspect ratio via etch using atomic layer deposition protection layer | Yen-Tien Lu, Xinghua Sun, Eric Chih-Fang Liu | 2021-09-14 |
| 10950444 | Metal hard mask layers for processing of microelectronic workpieces | Yen-Tien Lu, Kai-Hung Yu | 2021-03-16 |
| 10950460 | Method utilizing using post etch pattern encapsulation | Angelique Raley, Cory Wajda, Junling Sun | 2021-03-16 |
| 10937659 | Method of anisotropically etching adjacent lines with multi-color selectivity | Shihsheng Chang | 2021-03-02 |