Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164781 | ALD (atomic layer deposition) liner for via profile control and related applications | Yen-Tien Lu, Angelique Raley, David L. O'Meara, Jeffrey Smith | 2021-11-02 |
| 11127594 | Manufacturing methods for mandrel pull from spacers for multi-color patterning | Angelique Raley, Andrew Metz | 2021-09-21 |
| 11121027 | High aspect ratio via etch using atomic layer deposition protection layer | Yen-Tien Lu, Eric Chih-Fang Liu, Andrew Metz | 2021-09-14 |
| 11031798 | Charger for electronic cigarette | Yonghai Li, Zhongli Xu | 2021-06-08 |
| 10964587 | Atomic layer deposition for low-K trench protection during etch | Yen-Tien Lu, David L. O'Meara, Angelique Raley | 2021-03-30 |