Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164781 | ALD (atomic layer deposition) liner for via profile control and related applications | Xinghua Sun, Angelique Raley, David L. O'Meara, Jeffrey Smith | 2021-11-02 |
| 11121027 | High aspect ratio via etch using atomic layer deposition protection layer | Xinghua Sun, Eric Chih-Fang Liu, Andrew Metz | 2021-09-14 |
| 10964587 | Atomic layer deposition for low-K trench protection during etch | David L. O'Meara, Angelique Raley, Xinghua Sun | 2021-03-30 |
| 10950444 | Metal hard mask layers for processing of microelectronic workpieces | Kai-Hung Yu, Andrew Metz | 2021-03-16 |