Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121027 | High aspect ratio via etch using atomic layer deposition protection layer | Yen-Tien Lu, Xinghua Sun, Andrew Metz | 2021-09-14 |
| 10978307 | Deposition process | David L. O'Meara, Richard A. Farrell, Soo Doo Chae | 2021-04-13 |