Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10978307 | Deposition process | David L. O'Meara, Eric Chih-Fang Liu, Richard A. Farrell | 2021-04-13 |
| 10923392 | Interconnect structure and method of forming the same | Jeffrey Smith, Gerrit J. Leusink, Robert D. Clark, Kai-Hung Yu | 2021-02-16 |
| 10916561 | Method of fabricating semiconductor device | Karthik Pillai, Sangcheol Han | 2021-02-09 |