Issued Patents 2021
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152268 | Platform and method of operating for integrated end-to-end area-selective deposition process | Kandabara Tapily, Jason Mehigan | 2021-10-19 |
| 11101173 | Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using same | Jeffrey Smith, Kandabara Tapily, Angelique Raley, Qiang Zhao | 2021-08-24 |
| 11024535 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | Kai-Hung Yu, David L. O'Meara, Nicholas Joy, Gyanaranjan Pattanaik, Kandabara Tapily +3 more | 2021-06-01 |
| 10964608 | Platform and method of operating for integrated end-to-end gate contact process | — | 2021-03-30 |
| 10923394 | Platform and method of operating for integrated end-to-end fully self-aligned interconnect process | Kandabara Tapily, Kai-Hung Yu | 2021-02-16 |
| 10923392 | Interconnect structure and method of forming the same | Soo Doo Chae, Jeffrey Smith, Gerrit J. Leusink, Kai-Hung Yu | 2021-02-16 |
| 10916472 | Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using same | Jeffrey Smith, Kandabara Tapily, Angelique Raley, Qiang Zhao | 2021-02-09 |
| 10886173 | Platform and method of operating for integrated end-to-end fully self-aligned interconnect process | Kandabara Tapily, Kai-Hung Yu | 2021-01-05 |