| 11152268 |
Platform and method of operating for integrated end-to-end area-selective deposition process |
Kandabara Tapily, Jason Mehigan |
2021-10-19 |
| 11101173 |
Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using same |
Jeffrey Smith, Kandabara Tapily, Angelique Raley, Qiang Zhao |
2021-08-24 |
| 11024535 |
Method for filling recessed features in semiconductor devices with a low-resistivity metal |
Kai-Hung Yu, David L. O'Meara, Nicholas Joy, Gyanaranjan Pattanaik, Kandabara Tapily +3 more |
2021-06-01 |
| 10964608 |
Platform and method of operating for integrated end-to-end gate contact process |
— |
2021-03-30 |
| 10923394 |
Platform and method of operating for integrated end-to-end fully self-aligned interconnect process |
Kandabara Tapily, Kai-Hung Yu |
2021-02-16 |
| 10923392 |
Interconnect structure and method of forming the same |
Soo Doo Chae, Jeffrey Smith, Gerrit J. Leusink, Kai-Hung Yu |
2021-02-16 |
| 10916472 |
Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using same |
Jeffrey Smith, Kandabara Tapily, Angelique Raley, Qiang Zhao |
2021-02-09 |
| 10886173 |
Platform and method of operating for integrated end-to-end fully self-aligned interconnect process |
Kandabara Tapily, Kai-Hung Yu |
2021-01-05 |