Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171060 | Dual metal contacts with ruthenium metal plugs for semiconductor devices | Hiroaki Niimi | 2021-11-09 |
| 11024535 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | Kai-Hung Yu, David L. O'Meara, Nicholas Joy, Robert D. Clark, Kandabara Tapily +3 more | 2021-06-01 |