Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11024535 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | David L. O'Meara, Nicholas Joy, Gyanaranjan Pattanaik, Robert D. Clark, Kandabara Tapily +3 more | 2021-06-01 |
| 10950444 | Metal hard mask layers for processing of microelectronic workpieces | Yen-Tien Lu, Andrew Metz | 2021-03-16 |
| 10923392 | Interconnect structure and method of forming the same | Soo Doo Chae, Jeffrey Smith, Gerrit J. Leusink, Robert D. Clark | 2021-02-16 |
| 10923394 | Platform and method of operating for integrated end-to-end fully self-aligned interconnect process | Robert D. Clark, Kandabara Tapily | 2021-02-16 |
| 10886173 | Platform and method of operating for integrated end-to-end fully self-aligned interconnect process | Robert D. Clark, Kandabara Tapily | 2021-01-05 |