Issued Patents 2021
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11170992 | Area selective deposition for cap layer formation in advanced contacts | Gerrit J. Leusink | 2021-11-09 |
| 11152268 | Platform and method of operating for integrated end-to-end area-selective deposition process | Robert D. Clark, Jason Mehigan | 2021-10-19 |
| 11152207 | Method of forming titanium nitride films with (200) crystallographic texture | — | 2021-10-19 |
| 11114381 | Power distribution network for 3D logic and memory | Lars Liebmann, Jeffrey Smith, Anton J. deVilliers | 2021-09-07 |
| 11101173 | Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using same | Robert D. Clark, Jeffrey Smith, Angelique Raley, Qiang Zhao | 2021-08-24 |
| 11031287 | Fully self-aligned via with selective bilayer dielectric regrowth | Jeffrey Smith | 2021-06-08 |
| 11024535 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | Kai-Hung Yu, David L. O'Meara, Nicholas Joy, Gyanaranjan Pattanaik, Robert D. Clark +3 more | 2021-06-01 |
| 10991881 | Method for controlling the forming voltage in resistive random access memory devices | Steven P. Consiglio, Cory Wajda, Takaaki Tsunomura, Takashi Ando, Paul C. Jamison +3 more | 2021-04-27 |
| 10930764 | Extension region for a semiconductor device | Jeffrey Smith, Nihar Mohanty, Anton J. deVilliers | 2021-02-23 |
| 10923394 | Platform and method of operating for integrated end-to-end fully self-aligned interconnect process | Robert D. Clark, Kai-Hung Yu | 2021-02-16 |
| 10916472 | Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using same | Robert D. Clark, Jeffrey Smith, Angelique Raley, Qiang Zhao | 2021-02-09 |
| 10886173 | Platform and method of operating for integrated end-to-end fully self-aligned interconnect process | Robert D. Clark, Kai-Hung Yu | 2021-01-05 |