Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11024535 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | Kai-Hung Yu, David L. O'Meara, Nicholas Joy, Gyanaranjan Pattanaik, Robert D. Clark +3 more | 2021-06-01 |
| 10991881 | Method for controlling the forming voltage in resistive random access memory devices | Steven P. Consiglio, Kandabara Tapily, Takaaki Tsunomura, Takashi Ando, Paul C. Jamison +3 more | 2021-04-27 |
| 10950460 | Method utilizing using post etch pattern encapsulation | Angelique Raley, Andrew Metz, Junling Sun | 2021-03-16 |