Issued Patents 2021
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183474 | Electronic device package and method for manufacturing the same | Mei-Ju Lu, Chi-Han Chen, Chang-Yu Lin, Jr-Wei LIN | 2021-11-23 |
| 11139222 | Electronic device comprising heat pipe contacting a cover structure for heat dissipation | Jung-Che Tsai, Ian HU | 2021-10-05 |
| 11081420 | Substrate structure and semiconductor package structure | Hsin-En Chen, Ian HU | 2021-08-03 |
| 11075186 | Semiconductor package | Ian HU, Jia-Rung Ho, Jin-Feng Yang, Ping-Feng Yang | 2021-07-27 |
| 11011496 | Semiconductor device packages and methods of manufacturing the same | Tang-Yuan Chen, Meng-Kai SHIH, Teck-Chong Lee, Shin-Luh TARNG | 2021-05-18 |
| 10985085 | Semiconductor device package and method for manufacturing the same | Ian HU, Meng-Kai SHIH | 2021-04-20 |
| 10916429 | Semiconductor device packages and stacked package assemblies including high density interconnections | John Richard Hunt, William T. Chen, Chen-Chao Wang | 2021-02-09 |
| 10886263 | Stacked semiconductor package assemblies including double sided redistribution layers | William T. Chen, John Richard Hunt, Chen-Chao Wang, Chih-Yi Huang | 2021-01-05 |