Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10886263 | Stacked semiconductor package assemblies including double sided redistribution layers | William T. Chen, John Richard Hunt, Chih-Pin Hung, Chen-Chao Wang | 2021-01-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10886263 | Stacked semiconductor package assemblies including double sided redistribution layers | William T. Chen, John Richard Hunt, Chih-Pin Hung, Chen-Chao Wang | 2021-01-05 |