Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10916429 | Semiconductor device packages and stacked package assemblies including high density interconnections | William T. Chen, Chih-Pin Hung, Chen-Chao Wang | 2021-02-09 |
| 10886263 | Stacked semiconductor package assemblies including double sided redistribution layers | William T. Chen, Chih-Pin Hung, Chen-Chao Wang, Chih-Yi Huang | 2021-01-05 |