Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10916429 | Semiconductor device packages and stacked package assemblies including high density interconnections | John Richard Hunt, William T. Chen, Chih-Pin Hung | 2021-02-09 |
| 10903152 | Low loss substrate for high data rate applications | Yuan-Hsi Chou, Tsun-Lung Hsieh | 2021-01-26 |
| 10903561 | Semiconductor device package and method of manufacturing the same | Chien-Hua Chen, Sheng-Chi Hsieh, Teck-Chong Lee | 2021-01-26 |
| 10886263 | Stacked semiconductor package assemblies including double sided redistribution layers | William T. Chen, John Richard Hunt, Chih-Pin Hung, Chih-Yi Huang | 2021-01-05 |