Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164756 | Semiconductor device package having continously formed tapered protrusions | Ying-Xu Lu, Jin-Yuan Lai, Tse-Chuan Chou, Meng-Kai SHIH, Shin-Luh TARNG | 2021-11-02 |
| 11011496 | Semiconductor device packages and methods of manufacturing the same | Meng-Kai SHIH, Teck-Chong Lee, Shin-Luh TARNG, Chih-Pin Hung | 2021-05-18 |