Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183474 | Electronic device package and method for manufacturing the same | Chi-Han Chen, Chang-Yu Lin, Jr-Wei LIN, Chih-Pin Hung | 2021-11-23 |
| 10989885 | Semiconductor package structure and method for manufacturing the same | Chi-Han Chen, Zong-Yu Yang, Pei-Jung YANG | 2021-04-27 |