Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183474 | Electronic device package and method for manufacturing the same | Mei-Ju Lu, Chang-Yu Lin, Jr-Wei LIN, Chih-Pin Hung | 2021-11-23 |
| 11063013 | Semiconductor package structure | Hung-Yi Lin | 2021-07-13 |
| 10989885 | Semiconductor package structure and method for manufacturing the same | Mei-Ju Lu, Zong-Yu Yang, Pei-Jung YANG | 2021-04-27 |
| 10930627 | Semiconductor package device and method of manufacturing the same | Chang-Yu Lin, Chieh-Chen Fu | 2021-02-23 |