Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10930627 | Semiconductor package device and method of manufacturing the same | Chang-Yu Lin, Chi-Han Chen | 2021-02-23 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10930627 | Semiconductor package device and method of manufacturing the same | Chang-Yu Lin, Chi-Han Chen | 2021-02-23 |