Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183474 | Electronic device package and method for manufacturing the same | Mei-Ju Lu, Chi-Han Chen, Chang-Yu Lin, Chih-Pin Hung | 2021-11-23 |
| 11152529 | Semicondutor package structures and methods of manufacturing the same | — | 2021-10-19 |
| 11145621 | Semiconductor package device and method of manufacturing the same | Chia-Cheng Liu, Chien-Feng Chan | 2021-10-12 |