Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145621 | Semiconductor package device and method of manufacturing the same | Jr-Wei LIN, Chia-Cheng Liu | 2021-10-12 |
| 10936020 | Electronic device and expansion device | Ching-Shiang Chang, Tung-Ying Wu, Wang-Hung Yeh, Po-Hsuan Wang, Ming-Cheng Tsou | 2021-03-02 |