{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Substrate structure and semiconductor package structure", "item": "https://www.patentleaderboard.com/patent/11081420"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Substrate structure and semiconductor package structure

Substrate structure and semiconductor package structure

US Patent 11081420 · Granted Aug 3, 2021

Estimated economic value: $3,865,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electronic device package and method for manufacturing the same2025
Semiconductor package structure and semiconductor manufacturing process2025
Semiconductor device package and method of manufacturing the same2025
Capacitor structure2025
Semiconductor device packages and methods of manufacturing the same2024
Electronic device2024
Heat transfer element, method for forming the same and semiconductor structure c2024
Semiconductor device package and method of manufacturing the same2024
Package structure and method for manufacturing the same2024
Electronic device package and method for manufacturing the same2023
Semiconductor device package and method of manufacturing the same2023
Semiconductor device packages and methods of manufacturing the same2023